Dry molding material 'Bioglass' suitable for sealing for 5G and IoT applications.
Low-loss, high-reliability sealing materials required in the era of high-speed communication. Supports miniaturized components and aids in the production of next-generation communication devices.
In high-frequency electronic components, the insulation performance, heat resistance, and processing accuracy of the sealing material are important. "Biloglass" can accommodate fine shapes due to its high fluidity design, achieving both mass production and sealing quality. High reliability can be obtained even without post-curing, making it suitable for the manufacture of highly integrated modules. 【Features】 - Compatible with high-frequency components - Low dielectric/insulating properties - High fluidity/low-pressure molding - Process reduction - Sealing for small devices *For more details, please refer to the PDF document or feel free to contact us.
- Company：三菱ガス化学ネクスト（旧日本ユピカ） 本社
- Price：Other
